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100G BASE-LR4/OTU4 10km CFP2 Transceiver

100G BASE-LR4/OTU4 10km CFP2 Transceiver

MTRD-DG3CA CFP2 transceivers are designedfor use in 100Gigabit Ethernet links and OTU4over 10km single module fiber, and it compliant tothe CFP MSA CFP2 HW Specification and IEEE802.3ba 100GBASE-LR4. Digital diagnostics areavailable via MDIO as specified
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产品模块: 100G BASE-LR4/OTU4 10km CFP2 Transceiver
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 Description 

MTRD-DG3CA CFP2 transceivers are designedfor use in 100Gigabit Ethernet links and OTU4over 10km single module fiber, and it compliant tothe CFP MSA CFP2 HW Specification and IEEE802.3ba 100GBASE-LR4. Digital diagnostics areavailable via MDIO as specified in the CFP MSAManagement Interface Specification.The transceiver's designs are optimized for highperformance and cost efficiency to providecustomers the best solutions for Datacom andTelecom applications.

Features   

Up to10km transmission on SMF

Support Dual Rate 103.1G and 111.8Gbps

Transmitter:4-lane*28Gb/s LAN-WDM EML TOSA  (1295.56nm,1300.05nm,1304.58nm,1309.14nm)

Receiver:4-lane*28Gb/s PIN ROSA

MDIO management interface with Digital Diagnostic

CFP2 MSA package with duplex LC connector

+3.3V power supply

Power consumption less than 9W

Operating case temperature: 0~+70°C

 

Applications  

100GE Routers and Switches

100G DWDM/OTN

100G Network Security

Compliance  

Compliant with IEEE 802.3ba 100GBASER-LR4

Compliant with ITU-T 411-9D1F

Compliant with CFP MSA CFP2 Hardware Specification  

 

Specification

 

Absolute Maximum Ratings

 

 

Parameter

Symbol

Conditions

Min.

Max.

Unit

Storage Temperature(Case)

TS 

 

-40

+85

 

Relative Humidity

RH

 

5

+85

%

Damage Threshold for Receiver

Pmax

 

 

+10.0

dBm

Power Supply

Vcc

 

-0.3

+3.6

V

ESD Sensitivity on module and all host pins

HBM

Human Body model R=1.5K,

C=100pF

 

2000

  

Recommended Operating Conditions

 

 

Parameter

Symbol  

Min.

Typical

Max.

Unit

Operating Case Temperature

Tc

0

 

+70

 

Supply voltage

 Vcc 3.3V

+3.14

+3.3

+3.47

V

Supply Current

Icc 3.3V

 

 

3.3

A

Power dissipation

P

 

 

9

W

Low Power dissipation

PLow

 

 

2

W

In-rush Curent

I-inrush

 

 

200

mA/us

Turn-off rush Curent

I-turnoff

-200

 

 

mA/us

Link Distance

L

2M

 

10km

 

  

Transmitter Operating Characteristic-Optical (100GBASE-LR4) 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

 

 

 

25.7812

 

Gbps

Aggregate data rate

 

 

 

103.125

 

Gbps

Data rate variation

 

 

-100

 

+100

ppm

Lane Center Wavelength

λcT0

 

1294.53

1295.56

1296.59

nm

λcT1

 

1299.02

1300.05

1301.09

nm

λcT2

 

1303.54

1304.58

1305.63

nm

λcT3

 

1308.09

1309.14

1310.19

nm

Total Average Launch Power

Pout

 

 

 

10.5

dBm

Average Launch Power per

Lane

Peach

 

-4.3

 

4.5

dBm

Optical Modulation Amplitude per Lane

OMA

 

-1.3

 

4.5

dBm

Difference in Launch power between any two lances(OMA)

 

 

 

 

5.0

dB

Launch power in OMA minus

TDP, per lane

Pomatdp

 

-2.3

 

 

dBm

Average Launch Power of

TX_DIS Transmitter per lane

Poff

TX_DIS=H

 

 

-30

dBm

Extinction Ratio

ER

 

4

5.5

 

dB

SMSR

SMSR

 

30

 

 

dB

Dispersion Penalty

DP

10km SMF

 

 

2.2

dB

Relative Intensity Noise

RIN

Mod off

 

 

-130

dB/Hz

Opitcal Return Loss Tolerance

TRL 

 

 

 

20

dB

Transmitter reflectance

Tef

 

 

 

-12

dB

Optical Eye Mask {X1, X2, X3,

Y1, Y2, Y3}1 

EMM

 

{0.25, 0.4, 0.45, 0.25, 0.28, 0.4}

 

Notes:

[1] Please refer to Figure 1   

 Figure 1. Transmission eye mask definition

 

Receiver Operating Characteristic-Optical (100GBASE-LR4) 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

 

 

 

25.7812

 

Gbps

Data rate variation

 

 

-100

 

+100

ppm

Lane Center Wavelength

λcT0

 

1294.53

1295.56

1296.59

nm

λcT1

 

1299.02

1300.05

1301.09

nm

λcT2

 

1303.54

1304.58

1305.63

nm

λcT3

 

1308.09

1309.14

1310.19

nm

Damage threshold

PDT

 

 

5.5

 

dBm

Average receiver power per

Rpow

 

-10.6

 

4.5

dBm

lane

 

 

 

 

 

 

Receive power OMA per Lane

Rovl

 

 

 

4.5

dBm

Difference in receive power between any two lanes(OMA)

 

 

 

 

5.5

dB

Receiver Sensitivity(OMA) per lane

Psen

 

 

 

-8.6

dBm

Stressed Receiver Sensitivity per Lane

Psen_str

 

 

 

-6.8

dBm

Receiver Reflectance

Ref

 

-26

dB

Conditions of stressed receiver sensitivity test

Vertical eye closure penalty per

Lane

 

 

1.8

dB

Stressed eye jitter per Lane

 

 

 

0.3

UI

Rx-Lane LOS Assert

 

 

 

-12

dBm

Rx-Lane LOS Deassert

 

 

-13.6

 

 

dBm

Rx-Lane LOS Hysteresis

 

 

0.5

 

 

dB

 

Transmitter Operating Characteristic-Optical (OTU4) 

 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

 

 

 

27.9525

 

Gbps

Aggregate data rate

 

 

 

111.809

 

Gbps

Data rate variation

 

 

-20

 

+20

ppm

Lane Center Wavelength

λcT0

 

1294.53

1295.56

1296.59

nm

λcT1

 

1299.02

1300.05

1301.09

nm

λcT2

 

1303.54

1304.58

1305.63

nm

λcT3

 

1308.09

1309.14

1310.19

nm

Total Average Launch Power

Pout

 

 

 

8.9

dBm

Average Launch Power per

Lane

Peach

 

-2.5

 

2.9

dBm

Optical Modulation Amplitude per Lane

OMA

 

-1.2

 

4.5

dBm

Difference in Launch power between any two lances(OMA)

 

 

 

 

5.0

dB

Average Launch Power of

TX_DIS Transmitter per lane

Poff

TX_DIS=H

 

 

-30

dBm

Extinction Ratio

ER

 

7

 

 

dB

SMSR

SMSR

 

30

 

 

dB

Relative Intensity Noise

RIN

Mod off

 

 

-130

dB/Hz

Opitcal Return Loss Tolerance

TRL 

 

 

 

20

dB

Transmitter reflectance

Tef

 

 

 

-26

dB

Optical Eye Mask {X1, X2, X3,

Y1, Y2, Y3}1 

EMM

 

NRZ 25G RATIO

 {x1:0.25,x2:0.4,x3:0.45, y1:0.25,y2:0.28,y3:0.4}

 

 

 

Receiver Operating Characteristic-Optical (OTU4) 

 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

 

 

 

27.9525

 

Gbps

Data rate variation

 

 

-20

 

+20

ppm

Lane Center Wavelength

λcT0

 

1294.53

1295.56

1296.59

nm

λcT1

 

1299.02

1300.05

1301.09

nm

λcT2

 

1303.54

1304.58

1305.63

nm

λcT3

 

1308.09

1309.14

1310.19

nm

Damage threshold

PDT 

 

 

5.5

 

dBm

Average receiver power per lane

Rpow

 

-8.8

 

2.9

dBm

Average total input power

 

 

 

 

8.9

dBm

Channel power difference

 

 

 

 

5.5

dB

Optical path penalty

 

 

 

 

1.5

dB

Receiver Sensitivity per lane2 

Psen

 

 

 

-10.3

dBm

Receiver Reflectance

Ref

 

 

 

-26

dB

Rx-Lane LOS Assert

 

 

-13.6

 

 

dBm

Rx-Lane LOS Deassert

 

 

 

 

-12

dBm

Rx-Lane LOS Hysteresis

 

 

0.5

 

 

dB

Sinusoidal Jitter, High

Frequency

 

 

 

 

0.05

UIpp 

 Notes:

[1] Please refer to Figure 1

[2] OTU-4 Rate without FEC, BER < 10-12, ER > 7dB

 

Electrical High Speed I/O Interface Characteristic-Transmitter(CEI-28G-VSR input interface) 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Signal Rate Per Lane

 

100GE

 

25.7812

 

Gb/s

Signal Rate Per Lane

 

OTU4

 

27.9525

 

Gb/s

Signal Rate Tolerance

 

100GE

-100

 

100

ppm

Signal Rate Tolerance

 

OTU4

-20

 

20

ppm

Input Differential Voltage

Vdiff

Emphasis off

Note1 

 

1200

mV

Differential Input Resistance

Rdin

 

85

100

115

Input Impedance Mismatch

Rm

 

 

 

5

%

Sinusoidal Jitter, Maximum

 

 

 

 

5

UIpp

Notes:

[1] Meets CEI-28G-VSR compliance requirements

 

Electrical High Speed I/O Interface Characteristic-Receiver(CEI-28G-VSR output interface) 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Signal Rate Per Lane

 

100GE

 

25.7812

 

Gb/s

Signal Rate Per Lane

 

OTU4

 

27.9525

 

Gb/s

Signal Rate Tolerance

 

100GE

-100

 

100

ppm

Signal Rate Tolerance

 

OTU4

-20

 

20

ppm

Output Differential Voltage

Vdiff

Equalization

off

600

750

900

mV

Differential Resistance

Rdo

 

85

100

115

Differential Termination

Resistance Mismatch

Rdm

 

 

 

5

%

Output Rise and Fall Time

T_tr, T_tf

20% to 80%

 

 

15

ps

Common Mode Noise(RMS)

Ncm

 

 

 

12

mV

Uncorrelated Unbounded

Gaussian Jitter

 

 

 

0.1

0.15

UI

Uncorrelated Bounded High

Probability Jitter

 

 

 

0.18

0.28

UI

Total Jitter

Tj 

 

 

0.28

0.43

UI 

 

3.3V LVCMOS Electrical Low Speed I/O Interface Characteristic 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Supply Voltage

Vcc

 

3.2

3.3

3.4

V

Input High Voltage

VIH

 

2

 

Vcc+0.3

V

Input Low Voltage

VIL

 

-0.3

 

0.8

V

Input Leakage Current

IIN

 

-10

 

+10

mA

Output High Voltage  

(IOH =-100uA)

VOH

 

Vcc-0.2

 

Vcc+0.3

V

Output Low Voltage

 (IOL =100uA)

VOL

 

-0.3

 

0.2

V

Minimum  Pulse  Width  of  

Control Pin Signal

t_CNTL

 

100

 

 

us 

Notes.

 (MOD_RSTn, MOD_LOPWR, TX_DIS, PRG_CNTL, MOD_ABS, RX_LOS, GLB_ALRMn, PRG_ALRM ) are

LVCMOS I/O interfaces. 

 

1.2V LVCMOS Electrical Low Speed I/O Interface Characteristic 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Input High Voltage

VIH

 

0.84

 

1.5

V

Input Low Voltage

VIL

 

-0.3

 

0.36

V

Input Leakage Current

IIN

 

-100

 

+100

uA

Output High Voltage  

VOH

 

1.0

 

1.5

V

Output Low Voltage

VOL

 

-0.3

 

0.2

V

Output High Current

IOH

 

 

 

-4

mA

Output Low Current

IOL

 

+4

 

 

mA

Input capacitance

Ci

 

 

 

10

pF

Notes.

 (MDIO, MDC, PRTADR4:0) are 1.2V LVCMOS I/O interfaces

Timing Parameters for CFP2 Hardware Signal Pins  

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Hardware MOD_LOPWR

assert

t_MOD_LOPWR_assert

 

 

 

1

ms

Hardware MOD_LOPWR

deassert

t_MOD_LOPWR_deass ert

 

 

 

10

s

Receiver Loss of Signal Assert

Time

t_loss_assert

 

 

 

100

us1 

Receiver Loss of Signal

De-Assert Time

t_loss_deassert

 

 

 

100

us1 

Global Alarm Assert Delay Time

GLB_ALRMn_assert

 

 

 

150

ms

Global Alarm De-Assert Delay

Time

GLB_ALRMn_deassert

 

 

 

150

ms

Management Interface Clock

Period

t_prd

 

250

 

 

ns

Host MDIO t_setup

t_setup

 

10

 

 

ns

Host MDIO t_hold

t_hold

 

10

 

 

ns

CFP MDIO t_delay

t_delay

 

0

 

175

ns

Initialization time from Reset

t_initialize

 

 

 

2.5

s

Transmitter Disabled  (TX_DIS asserted)

t_deassert

 

 

 

100

us

Transmitter Enabled  

(TX_DIS de-asserted)

t_assert

 

 

 

2

ms

Notes.

[1] Maximum value designed to support telecom applications 

 

MDIO and MDC Timing Characteristics 

 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Management Interface Clock

Frequency

F_MDC

 

0.1

 

4

MHz

Management Interface Clock

Period

t_prd

 

250

 

10000

ns

Host MDIO t_setup

t_setup

 

10

 

 

ns

Host MDIO t_hold

t_hold

 

10

 

 

ns

CFP MDIO t_delay1 

t_delay

 

0

 

175

ns

MDC high and low time

twidth

 

40

 

60

%

 

160

 

 

ns

MDIO/MDC termination in CFP

Zt

 

100

 

 

kOhm 

Notes.

[1] Delay from MDC rising edge to MDIO data change.

                                                                                 Figure 2. MDIO & MDC Timing Diagram

 

Reference Clock Characteristics 

 

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Impedance

Zd

 

80

100

120

ohm

Frequency

 

 

1/40 of host lane rate

 

Frequency Stability

Xf

 

-100

 

+100

ppm1 

 

-20

 

+20

ppm2 

Input Differential Voltage

Vdiff

 

400

 

1200

mV3 

RMS Jitter

&sigma; 

 

 

 

10

ps4 

Clock Duty Cycle

 

 

40

 

60

%

Clock Rise/Fall Time 10/90%

Tr/f

 

200

 

1250

ps5 

 Notes.

[1] For Ethernet applications

[2]  For Telecom applications

[3] Peak to Peak Differential

[4] Random Jitter. Over frequency band of 10kHz < f < 10MHz

[5] 1/40 of electrical lane

Pin-out Definition

 

                                                                      Figure 3. CFP2 Connector Pin Map Orientation 

                                                                                  Figure 4. CFP2 Pin Map Connector 

 

                       Figure 5. CFP2 Module Pin Map

Notes.

[1] Pin 15,16,36,37,38, are internally used and NOT allowed to connect any signal and power supply or GND.  

[2] Pin 2,3,50,51 are disabled unless MCLK output is enabled via MDIO. 

 

Pin definition

PIN

Name

I/O

 

Logic

Description

1

GND

 

 

 

 

2

(TX_MCLKn)

O

CML

 

Not Support

3

(TX_MCLKp)

O

CML

 

Not Support

4

GND

 

 

 

 

5

N.C

 

 

 

No Connect

6

N.C

 

 

 

No Connect

7

3.3V_GND

 

 

 

3.3V Module Supply Voltage Return Ground, can be

8

3.3V_GND

 

 

 

   separate or tied together with Signal Ground

 

9

3.3V

 

 

 

   3.3V Module Supply Voltage

 

10

3.3V

 

 

3.3V Module Supply Voltage

11

3.3V

 

 

3.3V Module Supply Voltage

12

3.3V

 

 

3.3V Module Supply Voltage

13

3.3V_GND

 

 

 

14

3.3V_GND

 

 

 

15

VND_IO_A

I/O

 

Module Vendor I/O. Must No Connect at host board

16

VND_IO_B

I/O

 

Module Vendor I/O. Must No Connect at host board

17

PRG_CNTL1

 

 

I

LVCMOS w/ PUR

Programmable Control 1 set over MDIO, MSA Default: TRXIC_RSTn, TX & RX ICs reset, "0": reset, "1" or NC:

enabled = not used

4.75kohm pull up in the module

18

PRG_CNTL2

 

 

I

LVCMOS w/ PUR

Programmable Control 2 set over MDIO, MSA Default:

Hardware Interlock LSB, "00": &le;3W, "01":&le;6W, "10": &le;9W,

"11" or NC: &le;12W = not used

4.75kohm pull up in the module

19

PRG_CNTL3

 

 

I

LVCMOS w/ PUR

Programmable Control 3 set over MDIO, MSA Default: Hardware Interlock MSB, "00": &le;3W, "01": &le;6W, "10": &le;9W,

"11" or NC: &le;12W = not used

4.75kohm pull up in the module

20

PRG_ALRM1

 

 

O

LVCMOS

Programmable Alarm 1 set over MDIO, MSA Default: HIPWR_ON, "1": module power up completed, "0": module not high powered up

21

PRG_ALRM2

 

O

LVCMOS

Programmable Alarm 2 set over MDIO, MSA Default: MOD_READY, "1": Ready, "0": not Ready.

22

PRG_ALRM3

 

O

LVCMOS

Programmable Alarm 3 set over MDIO, MSA Default:

MOD_FAULT, fault detected, "1": Fault, "0": No Fault

23

GND

 

 

 

24

TX_DIS

 

I

LVCMOS w/ PUR

Transmitter Disable for all lanes, "1" or NC = transmitter disabled, "0" = transmitter enabled

25

RX_LOS

 

O

LVCMOS

Receiver Loss of Optical Signal, "1": low optical signal, "0":

normal condition

26

MOD_LOPWR

 

I

LVCMOS w/ PUR

Module Low Power Mode. "1" or NC: module in low power

(safe) mode, "0": power-on enabled

4.75kohm pull up in the module

27

MOD_ABS

 

O

GND

Module Absent. "1" or NC: module absent, "0": module present, Pull Up Resistor on Host

28

MOD_RSTn

I

LVCMOS w/ PDR

Module Reset. "0" resets the module, "1" or NC = module enabled, 4.75kohm pull down in the module

29

GLB_ALRMn

 

 O

LVCMOS

Global Alarm. “0": alarm condition in any MDIO Alarm register, "1": no alarm condition, Open Drain, Pull Up Resistor on Host

 

30

GND

 

 

 

31

MDC

 

I

1.2V CMOS

Management Data Clock (electrical specs as per 802.3ae and ba)

32

MDIO

 

I/O

1.2V CMOS

Management Data I/O bi-directional data (electrical specs as per 802.3ae and ba)

33

PRTADR0

 

I

1.2V CMOS

MDIO Physical Port address bit 0

34

PRTADR1

 

I

1.2V CMOS

MDIO Physical Port address bit 1

35

PRTADR2

 

I

1.2V CMOS

MDIO Physical Port address bit 2

36

VND_IO_C

I/O

 

Module Vendor I/O C. Do Not Connect!

37

VND_IO_D

I/O

 

Module Vendor I/O D. Do Not Connect!

38

VND_IO_E

I/O

 

Module Vendor I/O E. Do Not Connect!

39

3.3V_GND

 

 

 

40

3.3V_GND

 

 

 

41

3.3V

 

 

3.3V Module Supply Voltage

42

3.3V